Researchers at Shanghai University have developed a physics-constrained, data-efficient artificial intelligence framework that enables accurate thermal field inversion in chiplet-based packaging ...
GlobalData on MSN
Post-consumer reality of packaging waste
Once packaging leaves the consumer, it enters fragmented collection and sorting systems where contamination, infrastructure gaps, and market forces determine its fate.
North Macedonia Packaging Automation Market to hit USD 18.4 Bn by 2036 at 4.7% CAGR, driven by automation adoption.
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