Broadcom (AVGO) said that it expects to sell at least 1M chips by 2027 based on its stacked design technology.
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The future of chips: how gate-all-around design is powering the AI era and the next node
Artificial intelligence (AI) is transforming how the world builds and uses computer chips. From massive data centers to devices at the edge of the network, AI requires chips continuing to get faster, ...
By Max A. Cherney SAN JOSE, California, Feb 26 (Reuters) - Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech ...
OLIX Computing Ltd., a startup developing an artificial intelligence chip with integrated optical components, has raised $220 ...
Agentic artificial intelligence startup ChipAgents said today it’s ready to bring automation to one of the toughest ...
MatX raises $500M to develop AI chips for large language models and compete with Nvidia, enabling advanced applications.
The semiconductor industry has been applying AI to accelerate chip design for over three years, achieving 10X productivity gains and focusing primarily on tasks that now seem relatively easy, such as ...
Micron has delivered impressive results so far in 2026.
Embedded silicon capacitors, or ECAPs, aim to solve issues of power integrity from inside the processor’s package.
At the IESA Vision Summit, Radhika Viswanathan of Applied Materials said India has strong chip design skills but lacks core ...
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